Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Finetech Fineplacer Lambda Sub Micron, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Fineplacer Lambda Sub MicronFinetech |
|---|---|---|
| OEM | Applied Materials | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2017 Vintage year |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Finetech Fineplacer Lambda |
| Specifications | ||
| Configuration | — | HDD and Software[1] |
| Accuracy | — | 0.5 µm[1] |
| Bonding force module | — | FD3[1] |
| Chip heating module | — | Included[1] |
| Optional dispensing module | — | FG3[1] |
| Software | — | WinFlipChip version 3.2 Revision 052[1] |
| PC | — | Included[1] |
| HDD | — | Included[1] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →