Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Esec E142, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | E142Esec |
|---|---|---|
| OEM | Applied Materials | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 4” to 12” |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Esec E142 |
| Specifications | ||
| Associated platform | — | Esec 2100 FC hS[1] |
| Option name | — | E142 strip mapping[1] |
| Bonding method | — | Flip Chip Bonding[1] |
| Wafer size | — | 4” to 12”[1] |
| Bonding accuracy | — | 8 μm @3s (High Accuracy Mode)[1] |
| Min. cycle time | — | 240 ms (incl. dip fluxing)[1] |
| Frame size | — | 6", 8” and 12"[1] |
| Die size | — | 0.2 (with small die kit) to 20 mm[1] |
| Die thickness | — | ≥ 0.05 mm / ≥ 2 mils (thinner on request)[1] |
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