Waferpedia

Comparison ledger

0020 23839 PartversusIndy

Applied Materials 0020 23839 Part, Tokyo Electron Indy, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
IndyTokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartTokyo Electron Indy
Cited variants—
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[2]—
Manufacturer—Tokyo Electron[3]
Model—Indy[3]
Category—Deposition[3]
Model variant—Indy-B-L[1]
Process—HiK Dielectric Process[1]
Wafer size—300mm[1]
Main power—480VAC, 3 phase[1]
Load stations—Two load stations[1]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]agsemiconductor.comagsemiconductor.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com