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Comparison ledger

0020 23839 PartversusSigma FxP

Applied Materials 0020 23839 Part, SPTS Sigma FxP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsSPTS
CategoryDepositionDeposition
Wafer size—Mk1 3 KW lamp (provide wafer heating)
Process node——
Introduced——
Production run—2010–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartSPTS Sigma
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]Includes:[2]
Wafer—8" compatible[2]
Phase—Power Box (415 VAC, 3 Phase)[2]
Station 1—Vacuum Cassette Handler (VCH)[2]
Station 2—Pre Heat Chamber[2]
Wafer size—Mk1 3 KW lamp (provide wafer heating)[3]
Station 3—W Dep Chamber[2]
Process type—PVD (Physical Vapor Deposition)[2]
Category—Deposition[3]
Power Box—415 VAC, 3 Phase[2]
Power supplies—PSU Power Supplies[2]
Vacuum / pumping—Cryo Compressors[3]
Station 4—Ti / TiN Dep chamber with titanium target (Ti 4N5), MDX II Advanced Energy 15 KW DC power supply, standard speed magnetron drive assembly, platen temp 40°C, onboard CTI 8F cryo pump model 8116065 G 001, argon delivery through a 300 sccm N2 calibrated MFC, nitrogen delivery through a 300 sccm N2 calibrated MFC, Advanced Energy RFX-600 13.56 MHz RF generator, base pressure <7E-8 Torr[2]
Station 5—Soft Sputter Etch Chamber with Advanced Energy RFX-600 13.56 MHz RF generator for platen RF, Aviza LF24 350 KHz RF generator for coil RF, argon delivery through 30 sccm N2 calibrated MFC, onboard CTI 8F cryo pump model 8116065 G 001, Aviza Silicon oil chiller to control wafer temp on the pedestal, base pressure <7-8 Torr[2]
Station 6—Vacuum Cassette Handler (VCH)[2]
Temperature—Platen temperature 40°C[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com