Waferpedia

Comparison ledger

0020 23839 Partversus100 CB Spin

Applied Materials 0020 23839 Part, CEE 100 CB Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsCEE
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartCEE 100
Cited variants—
  • CEE 100 CB Spin Coater Hot Plate[1]
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[2]With brake plates[3]
Configuration & options—With brake plates[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing