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Comparison ledger

0020 18455 PartversusBTT IV Thermal

Applied Materials 0020 18455 Part, Denton Vacuum BTT IV Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
BTT IV ThermalDenton Vacuum
OEMApplied MaterialsDenton Vacuum
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartDenton Vacuum BTT IV Thermal
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]Benchtop[3]
Voltage—208 V, Single Phase, 50/60 Hz, 20 A[2]
Power—208 V, Single Phase, 50/60 Hz, 20 A[2]
Vacuum—Turbo High Vacuum[2]
Controller—Touch Screen PLC Controller[2]
Thermal source configuration—Currently configured with one thermal evaporative source[2]
Thickness monitor—Crystal film thickness monitor option installed[2]
Bell jar—Quartz bell jar with implosion guard, 12" diameter x 18" high[2]
Ultimate vacuum—5*10-6 torr[4]
Vacuum system—70 l/sec turbomolecular pump, oil mechanical pump[4]
System features—Integrated touch screen control panel; automatic pumpdown and venting with manual overrides; automatic control of filament evaporation cycle; high vacuum valve; LN 2 cold trap clean[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]eicn.cnsi.ucla.edueicn.cnsi.ucla.edu