Waferpedia

Comparison ledger

0010 47763versus900e

Applied Materials 0010 47763, Tegal 900e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
900eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Tegal 900e
Cited variants—
Specifications
Configuration2nd Source New[2]—
TypeMonopolar Dual Heated[3]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[3]—
Model0010-47763[2]—
OEMApplied Materials[2]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[3]—
Quantity available (source)1[3]—
Tool type—single wafer cassette-to-cassette etch system[1]
Process—non-critical plasma etch processes[1]
Wafer size—3 in to 150 mm wafers[1]
Control system—Advanced Control System (ACS) field upgrades available for customers already invested in the Tegal 900e Series[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]saulcontrol.comsaulcontrol.com
  4. [4]getspares.comgetspares.com