Waferpedia

Comparison ledger

0010 47763versusMultiplex ICP Advanced Oxide

Applied Materials 0010 47763, STS Multiplex ICP Advanced Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
OEMApplied MaterialsSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763STS Multiplex ICP
Specifications
Configuration2nd Source New[1]80 A[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Voltage—208 V[4]
Frequency—60 Hz[4]
RF Generators—ENI ACG10B 1kW (13.56MHz)[4]
Clamp Type—Standard WTC[4]
Platen Type—Domed[4]
Turbo Pump—None[4]
MACs Robot—None[4]
Pumping System—None[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing