Waferpedia

Comparison ledger

0010 47763versusFlex Expl Dry

Applied Materials 0010 47763, Lam Research Flex Expl Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Flex Expl DryLam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research Flex Expl Dry
Specifications
Configuration2nd Source New[1]—
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]Flex Expl[5]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Manufacturer—Lam Research[4]
Category—Etch[4]
Tool name—Flex Expl Dry[4]
Tool type—Dry etcher[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]Equipment inventory listing