Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, KLA Surfscan 6420, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2023 End of life |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | KLA Surfscan 6420 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Defect sensitivity (polished silicon) | — | Better than 0.12 µm at 95% capture rate[3] |
| Defect sensitivity (most surfaces) | — | Better than 0.12 µm[4] |
| Particle size range | — | 0.15 µm to greater than 3 µm[5] |
| Throughput | — | Up to 100 wafers per hour (200 mm)[5] |
| Repeatability | — | Within 1%, 1σ (mean count >500, 0.204 µm PSL)[5] |
| Illumination source | — | 30 mW Argon-Ion laser, 488 nm[3] |
| Operating software | — | Windows 98[3] |
| Substrate sizes | — | 2", 3", 4", 6", 8" wafers[3] |
| Substrate thickness | — | Adjustable up to 12 mm[3] |
| Material compatibility | — | Any surface that scatters less than 90% of incident light[3] |
| Cassette handling | — | Single puck handling from single cassette or platform[3] |
| Batch size | — | 1-25 wafers[5] |
| Process temperature | — | Room temperature[5] |
| Substrate materials | — | Silicon, thin layers of oxide, nitride, polymer/resist[5] |
| Power requirements | — | 208V, 60 Hz, 1 phase, 16A[6] |
| Haze sensitivity | — | 0.02 ppm[7] |
| Accuracy | — | Within 1%[7] |