Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Hitachi S 9300 CD-SEM, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | S 9300 CD-SEMHitachi |
|---|---|---|
| OEM | Applied Materials | Hitachi |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Wafer imaging ability; entire surface of 8” or 12” wafer |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Hitachi S 9300 CD-SEM |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | 2 cassette holders with ergo flippers[2] |
| Electron Gun | — | Schottky emission source[2] |
| Accelerating voltage | — | 500V to 1600V, 10V steps[2] |
| Probe Current | — | 4~24 pA with automated setting and measurement by Faraday cup[2] |
| Electromagnetic Lens | — | 3-Stage Electromagnetic Lens System with boosting voltage[2] |
| Objective Lens | — | 4 opening click stop, heated aperture is selectable/adjustable outside the vacuum[2] |
| Scan Coil | — | 2-Stage Electromagnetic Deflection[2] |
| Wafer size | — | Wafer imaging ability; entire surface of 8” or 12” wafer[2] |
| Depth of focus | — | ≥ 1.0 um at 80000x magnification[2] |
| Resolution | — | 3 nm (800V) Retarding/Boosting Mode[2] |
| Magnification | — | 1000x to >300000x[2] |
| Wafer Imaging | — | entire surface of 8” or 12” wafer[2] |
| Workstation | — | HP B180L with HP-UX 10.20 or newer[2] |
| Field of View | — | 1.2 mm[2] |
| Model | — | HP B180L (9GB)[2] |
| O/S | — | Unix version HP-UX 10.20 or newer[2] |
| Software Version | — | 14.71 or newer[2] |
| Tool type | — | Critical Dimension Scanning Electron Microscope (CD-SEM)[2] |
| Wafer size support | — | 8 inch[2] |
| Wafer imaging ability | — | Entire surface of 8" or 12" wafer[2] |
| Category | — | Metrology & Inspection[3] |
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