Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Applied Materials SEMVision G 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | SEMVision G 3Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Wafer Handling |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Applied Materials SEMVision |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | Configuration:[2] |
| Wafer size | — | Wafer Handling[2] |
| Loader | — | AMAT ADO with RFID / OCLP / SMIF[2] |
| Pal (On the OTW, cassette / Slot 1 | — | Delta X= 500 μms; Delta Y= 500 μm[2] |
| ITU Repeatability | — | Delta X and Delta Y < 20 μm[2] |
| Manufacturer | — | Applied Materials[2] |
| Model | — | SEMVision G 3[2] |
| Category | — | Metrology & Inspection[3] |
| Wafer handling | — | 8-inch and 12-inch wafer handling capability[3] |
| System performance | — | ITU Repeatability: Delta X and Delta Y < 20 μm; Stage accuracy: Delta X and Delta Y < 1.5 μm; MTR: Delta X = 50 μms; Delta Y = 30 μms[2] |
| Resolution at 1 KeV | — | 3 nm[2] |
| EDX resolution | — | 4 nm[2] |
| Wafer throughput | — | 15 wafers / hour[2] |
| Defects throughput | — | >1800 defects / hour[2] |
| Cleanliness front side | — | 0.013 PWP / cm2 > size at 0.2 μm[2] |
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