Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Endura 2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Endura 2Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Endura |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Liner / Barrier[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Software Version | — | 2.10_692[4] |
| System Power Rating | — | 208VAC/480VAC[4] |
| Loading Configuration | — | 3 TDK Loadports[4] |
| Chamber 1 | — | Impulse PVD[4] |
| Chamber 2 | — | Impulse PVD[4] |
| Chamber 3 | — | Impulse PVD[4] |
| Chamber E | — | DMD[4] |
| Chamber F | — | DMD[4] |
| Fi Robot | — | Yasakawa[6] |
| Wafer Carrier | — | 5x4" Wafer pocket, 4" Tray[9] |
| SiC Tray | — | 4", 6 hole, SiC Carrier (2 pc)[9] |
| Dry Pump | — | (2)[9] |
| Wafer Size | — | 12 inch (300 mm)[2] |
| Category | — | PVD (Physical Vapor Deposition)[2] |
| Front Interface Version | — | 5.3[4] |
| Mainframe | — | Endura II[4] |
| Chamber Configuration | — | 3 Impulse PVD chambers (Chambers 1-3), 2 DMD chambers (Chambers E and F)[4] |
| Robot Type | — | XP[2] |
| Pump | — | Dedicated[2] |
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