Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Mattson Aspen III, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | Aspen IIIMattson |
|---|---|---|
| OEM | Applied Materials | Mattson |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Mattson Aspen |
| Cited variants | — | |
| Specifications | ||
| Configuration | WP AL 300mm PVD[3] | Low K[7] |
| OEM | Applied Materials[3] | — |
| Model | 0010-03485[3] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[4] | — |
| Process | PVD[5] | — |
| Wafer size | 300mm[6] | 8 inch[7] |
| Version | Spares[6] | — |
| Part Number | 0010-03485[3] | — |
| Manufacturer | Applied Materials[3] | — |
| Process Type | PVD (Physical Vapor Deposition)[3] | — |
| Application (Material) | Aluminum (AL)[3] | — |
| Wafer Diameter (associated) | 300 mm[3] | — |
| Wafer sizes (Highlands) | — | 200 / 300 mm[1] |
| Wafer sizes (CVD) | — | 200 / 300 mm bridge tool[2] |
| Process technology (Highlands) | — | Proprietary ICP technology[1] |
| Processing capability (Highlands) | — | Dual-wafer processing[1] |
| Design (Highlands) | — | Modular design allowing process modules to be added[1] |
| Throughput (CVD) | — | Up to 180 wafers per hour[2] |
| Deposited films (CVD) | — | Silane-based films (oxide, oxynitride, nitride) and TEOS-based oxide films[2] |
| Bridge capability (CVD) | — | Same process chamber can process either 200mm or 300mm wafers[2] |