Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Besi 2200 EVO Tool Holder, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Besi 2200 EVO Tool Holder |
| Cited variants | — | |
| Specifications | ||
| Configuration | WP AL 300mm PVD[2] | — |
| OEM | Applied Materials[2] | — |
| Model | 0010-03485[2] | 2200 EVO Tool Holder[6] |
| Description | MAGNET ASSY, WP AL 300MM PVD[3] | — |
| Process | PVD[4] | — |
| Wafer size | 300mm[5] | — |
| Version | Spares[5] | — |
| Part Number | 0010-03485[2] | — |
| Manufacturer | Applied Materials[2] | — |
| Process Type | PVD (Physical Vapor Deposition)[2] | — |
| Application (Material) | Aluminum (AL)[2] | — |
| Wafer Diameter (associated) | 300 mm[2] | — |
| Make | — | Besi / Datacon[6] |
| Asset Number | — | 83809[6] |
| X/Y Placement Accuracy | — | ±10 µm @ 3σ[7] |
| Theta Placement Accuracy | — | ±0.15° @ 3σ[7] |
| Bond Force Range | — | 0.5N to 75N programmable[7] |
| UPH Die Attach | — | up to 7,000 UPH/module[7] |
| UPH Flip Chip with dipping | — | up to 2,500 UPH/module[7] |
| UPH Flip Chip without dipping | — | up to 3,200 UPH/module[7] |
| Machine Dimensions (LxDxH) | — | 1,160 mm x 1,225 mm x 1,750 mm[7] |
| Machine Weight | — | 1,300 kg[7] |
| Uptime | — | > 98%[7] |
| Yield | — | > 99.95%[7] |
| Die Size (Die Attach) | — | 0.17 mm - 50 mm[7] |
| Die Size (Flip Chip) | — | 0.5 mm - 50 mm[7] |
| Die Thickness | — | >50 µm (thinner on request)[7] |
| Wafer Size | — | 4" - 12" (SEMI M1)[7] |
| Frame Size | — | FF070, FF105, FF108, FF123; automatic change (others on request)[7] |
| Substrate Working Range | — | 13" x 8" (325 mm x 200 mm)[7] |
| Bond Head Rotation | — | 0° to 360°[7] |
| Heated Bond Head (optional) | — | up to 450°C[7] |
| UV Curing Wavelengths | — | 365 nm and 405 nm[7] |
| Product type | — | Tool holder[6] |
| Wafer handling | — | 12" wafer handling[7] |
| Integrated dispenser | — | Included[7] |
| Automatic tool changer | — | Included[7] |
| Vintage | — | 2010[8] |