Waferpedia

Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF200versus, Tokyo Semitsu Kogaku (TSK) UF3000

Accretech , Tokyo Semitsu Kogaku (TSK) UF200, Accretech , Tokyo Semitsu Kogaku (TSK) UF3000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMAccretechAccretech
Category——
Wafer sizeWafer EquipmentWafer Equipment
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF200Accretech , Tokyo Semitsu Kogaku (TSK) UF3000
Specifications
Wafer sizeWafer Equipment[1]Wafer Equipment[2]
Date of Manufacture1998[1]—
Currently Configured for200mm[1]300mm[2]
Current Equipment StatusAvailable[1]—
Available dateCurrently Available[1]—
Equipment categoryProduction Wafer Prober[1]—
With Chiller—SCU-600B[2]
Section 1—Tool General Information[2]
Section 2—Tool Specific Information[2]
Manufacturer—Accretech, Tokyo Semitsu Kogaku (TSK)[2]
Model—UF3000[2]
Category—Wafer Equipment[2]
Equipment type—Wafer Prober[2]
Tool status—In production[2]
Tool location—Cleanroom[2]
Chiller—SCU-600B[2]
Vendor tool serial number—F24006MZ[2]
Micron MISTI/LID number—FE3SKAA300(TMM)[2]
Year—2004[3]
Quantity—9[4]
Short description—Fully Automated Prober[4]
Version—300 mm[4]
Nickel chuck—12 inch[4]
Front loading—300 mm single FOUP loading[4]
Robot blade—Dual ceramic robot blade[4]
Software version—S5.0FC4[4]
Loader type—TSK[4]
Chuck temperature range—30~150℃[4]
OCR camera type—Type6[4]
Auto card change—Yes[4]
Needle cleaning unit—150 mm x 150 mm ceramics pad[4]
Manipulator—Hinge, MHF4000[4]
Test system interface—AL6050 & Focus3000[4]
Includes—Printer[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]dealer listingwotol.com
  3. [3]wotol.comwotol.com
  4. [4]wotol.comwotol.com