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Comparison ledger

PG 300 RM Grinder Lapperversus15 Lapper

Accretech PG 300 RM Grinder Lapper, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMAccretechLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech PG 300 RM Grinder LapperLapmaster 15
Specifications
ConfigurationHDD and Software included[1]Equipped with:[3]
Functiongrinder, lapper, and polisher[2]—
CategoryCMP[2]—
Control & softwareHDD and Software included[2]—
Number Of Conditioning Rings—Up to 3[3]
Ring ID—Up to 5.5″[3]
Plate Diameter – Outside—15″[3]
Plate Diameter – Inside—3 1/2″[3]
Standard RPM—60[3]
Drive Motor—1/2 HP[3]
Electrics—110V / 1Ph / 60Hz[3]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[3]
Equipped with: 15″ Cast Iron Plate—Included[3]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[3]
Equipped with: (3) Conditioning Rings—Included[3]
Equipped with: (3) Hold Downs—Included[3]
Equipped with: 30 Minute Timer—Included[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing