Comparison ledger
ABM -407B-1-S-CES293 Robot, Nikon NSR SF 130, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NSR SF 130Nikon | |
|---|---|---|
| OEM | ABM | Nikon |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Nikon NSR SF 130 |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Exposure Wavelength | — | i-line (365 nm)[2] |
| Numerical Aperture | — | ~0.50[2] |
| Max Wafer Size | — | 200 mm[2] |
| Throughput | — | ~100 wafers/hour[2] |
| Common Process Node | — | ≥ 0.25 μm[2] |
| Release Era | — | Early 2000s[2] |
| Optical System | — | High-quality projection lenses optimized for i-line lithography[2] |
| Stage and Alignment | — | Precision wafer stage with interferometer-based positioning, sub-micron alignment accuracy[2] |
| Automation | — | Motorized reticle loaders, wafer handling robots, SMIF pods[2] |
| Control Electronics | — | Proprietary Nikon control software and hardware[2] |