Comparison ledger
ABM -407B-1-S-CES293 Robot, Fuji NXT M 3 III Tray, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NXT M 3 III TrayFuji | |
|---|---|---|
| OEM | ABM | Fuji |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | — |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Applicable PCB size (double conveyor) | — | 48 x 48 mm to 250 x 510 mm[2] |
| Module width | — | 320 mm[2] |
| Placement speed (V12 head) | — | 26,000 cph[2] |
| Placement accuracy (V12 head) | — | +/-0.038 mm (3σ) cpk≥1.00[2] |
| Supported component size (V12 head) | — | 0402 to 7.5 x 7.5 mm, height up to 3.0 mm[2] |
| Part types supported | — | Up to 20 types (using 8 mm tape)[2] |
| Machine dimensions (typical, single-module) | — | 1295 x 1900 x 1476 mm[2] |
| Tray feeder option | — | Yes; applicable tray sizes: 135.9 x 322.6 mm (JEDEC standard), 276 x 330 mm, 143 x 330 mm[2] |
| PCB loading time (double conveyor) | — | 0 sec[2] |