Waferpedia

Comparison ledger

10490versus7700E Series

West Bond 10490, West Bond 7700E Series, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
7700E SeriesWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 7700E Series
Cited variants—
Specifications
ManufacturerWest Bond[2]—
Model10490[2]—
DescriptionConvertible bonder, wedge to ball[3]—
Tool typeConvertible bonder[4]—
Bonding modesWedge bonding and ball bonding[4]—
UseWire bonding[4]—
Model line—7700E Series[1]
Machine type—Manual operation ball-wedge bonder[1]
Bonding method—Thermosonic ball-wedge wire bonder[1]
Axis configuration—Manual X-Y-Z[1]
Application—Interconnect wire leads to semiconductor, hybrid, or microwave devices[1]
Wire type—Gold wire[1]
Wire diameter range—0.0007 inches and larger range stated in manual excerpt[1]
Bond tool shank diameter—1/16 inch[1]
Bond tool length—0.625 inch or 0.750 inch for deeper access[1]
Wire spool mount—Standard 1/2 inch ball bearing spool mount[1]
Buffer count—Thirty different buffers[1]
Maximum bonds per wire—21[1]
Wire tail default—95 motor steps[1]
Heater—Radiant heater for the wedge bonding tool[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]manualslib.commanualslib.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com