Waferpedia

Comparison ledger

10100versus7476

West Bond 10100, West Bond 7476, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
7476West Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 7476
Specifications
Equipment type—wire bonder[1]
Configuration—7400B / 7600B 90° vertical feed deep access wedge bonder[1]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com