Waferpedia

Comparison ledger

0332 F 9453 302 DiffusionversusSoltec MyReflow 7038

Varian 0332 F 9453 302 Diffusion, Vitronics Soltec MyReflow 7038, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMVarianVitronics
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 0332 F 9453 302 DiffusionVitronics Soltec
Specifications
Asset Number142841[1]—
Last Confirm DateOctober 14, 2025[2]—
Configuration—9 + 3 Zones[3]
Type—Reflow soldering system[4]
Transport—Pin chain transport[4]
Atmosphere—Nitrogen[4]
Heating zones—10[4]
Cooling zones—4[4]
Pin length—5 mm[4]
Pin distance—19 mm[4]
N2 pressure—6 bar[4]
PCB width—50 mm - 508 mm[4]
Maximum component height—40 mm / 30 mm (top / bottom)[4]
Transportation height—832 - 914 mm[4]
Width adjustment—Electrical[4]
Software version—4.0.6.b[4]
Construction year—2015[4]
Year—2004[5]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]fab-spares.comfab-spares.com
  3. [3]inventory listing
  4. [4]as-equipment.deas-equipment.de
  5. [5]wotol.comwotol.com