Temescal
CV-6S alternatives
Comparable Deposition equipment documented in the Waferpedia catalog.
6 comparable tools
Plasma-Therm
Versaline
4"
Deposition
The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.
Applied Materials
0010-13622 RF Match for
Deposition
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
Applied Materials
0020 12458 Part
Deposition
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.
Applied Materials
0020 17485 Part
Deposition
Applied Materials
0020 18455 Part
Deposition
Applied Materials 0020 18455 is a part described as "Shaft, Rf In Local Match, Hdpcvd, Rev3."
Applied Materials
0020 18698 Part
Deposition
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