Comparison ledger
SUSS MicroTec DSC300 Gen2, Zeiss Ultra-55, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DSC300 Gen2SUSS MicroTec | Ultra-55Zeiss |
|---|---|---|
| OEM | SUSS MicroTec | Zeiss |
| Category | Lithography | Lithography |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | Gen2 | — |
| Family | SUSS MicroTec DSC300 Gen2 | Zeiss Ultra-55 |
| Specifications | ||
| Type | Automated system[1] | — |
| Wafer size | up to 300 mm[1] | 300mm[3] |
| Process category | Projection lithography[1] | — |
| Exposure technology | Full-field scanning projection[1] | — |
| Alignment | Yes[1] | — |
| Installed accessory | — | Zyvex S-100 Nanoprobes installed on the Zeiss Ultra-55 SEM[2] |
| Operating condition | — | Operate under vacuum during imaging or with the beam blanked[2] |
| Probe count | — | Three individually controlled nanoprobes[2] |
| Placement precision | — | Five nanometers[2] |
| Minimum tip radius | — | Fifty nanometers[2] |
| Category | — | Lithography[3] |
| Instrument type | — | Field emission scanning electron microscope (FESEM)[4] |
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