Comparison ledger
Plasma-Therm 720/740, Tegal 980, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 720/740Plasma-Therm | 980Tegal |
|---|---|---|
| OEM | Plasma-Therm | Tegal |
| Category | Etch | Etch |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Plasma-Therm 720/740 | Tegal 980 |
| Cited variants | ||
| Specifications | ||
| system type | dual chamber RIE loadlocked system[1] | — |
| chemistry | chlorine and fluorine based chemistry[1] | — |
| left chamber designation | 740 (left chamber), designated Au exposure system[1] | — |
| right chamber designation | 720 (right chamber), designated for chlorine and fluorine based etching of 2D materials and perovskites[1] | — |
| wafer capacity | up to 200mm diameter wafers[1] | — |
| Chemistry | chlorine and fluorine based[1] | — |
| Max wafer diameter | 200mm[1] | — |
| Series name | — | 980 ACS Series[2] |
| Process type | — | Plasma etch[2] |
| Wafer size | — | 200mm[2] |
| System type | — | Single wafer cassette-to-cassette etch system[2] |
| Throughput | — | Faster throughput[2] |
| Calibration | — | Faster system calibration[2] |
| User interface | — | Touchscreen graphical user interface[2] |
| Data handling | — | Integrated data logging[2] |
| Factory automation | — | Factory automation support[2] |
| Tool format | — | Single wafer cassette-to-cassette etch system[2] |
| System calibration | — | Faster system calibration[2] |
| Automation | — | Factory automation support[2] |
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