Waferpedia

Comparison ledger

ACP28GversusFC-2000

Pfeiffer ACP28G, Temescal FC-2000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACP28GPfeiffer
FC-2000Temescal
OEMPfeifferTemescal
CategoryDepositionDeposition
Wafer size100mm100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPfeiffer ACP28GTemescal FC-2000
Cited variants—
Specifications
Pump typeDry pump[2]—
RoleLoadlock primary pump[2]—
ManufacturerPfeiffer[2]—
Contextual systemEVA 451 evaporator[2]—
Intended applicationPumping traces of corrosive gas[3]—
Pumping mechanismFrictionless multi-stage roots design[3]—
Voltage range90 to 254 VAC at 50 or 60 Hz[3]—
Overhaul interval22,000 hours[3]—
System name—Temescal FC-2000 deposition system[1]
System type—Bell jar deposition system[1]
Operation—Fast-cycle, load-locked system[1]
Vacuum handling—Allows the source to remain under vacuum during substrate reloading[1]
Source tray—Supports multiple electron beam and resistance sources[1]
Standard source-to-substrate distance—19.5 in[1]
Optional source-to-substrate distance with extension collar—27.5 in[1]
Bell jar diameter—20 in (508 mm)[1]
FC-2000 source tray diameter—18 in (457 mm)[1]
Control system—Temescal Control System (TCS)[1]
Deposition controller—Inficon XTC/3 deposition controller[1]
Electron beam power supply—Temescal model CV-6SLX electron beam power supply[1]
Beam sweep controller—Temescal SuperSweep64 programmable beam sweep controller[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]epfl.chepfl.ch
  3. [3]idealspectroscopy.comidealspectroscopy.com