Comparison ledger
Oxford Instruments PlasmaPro80, Tegal 980, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PlasmaPro80Oxford Instruments | 980Tegal |
|---|---|---|
| OEM | Oxford Instruments | Tegal |
| Category | Etch | Etch |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments PlasmaPro80 | Tegal 980 |
| Cited variants | ||
| Specifications | ||
| OEM | Oxford Instruments[1] | — |
| Model | PlasmaPro80[1] | — |
| Tool type | RIE dry etcher[1] | — |
| Chemistry | fluorine chemistry[1] | — |
| Process gases | CHF3, SF6, O2, Ar[1] | — |
| Maximum power | 300 W @ 13.56 MHz[1] | — |
| Load system | Open-load system (no load lock)[1] | — |
| Wafer handling | chips to wafer up to 200mm[1] | — |
| Wafer size | 100mm wafers[1] | 200mm[2] |
| Applications | hBN, SiGe, graphite and graphene soft etching[1] | — |
| Endpoint detection | Laser reflectometry/interferometry end-point-detection[1] | — |
| Process type | RIE (Reactive Ion Etching), dry etcher[1] | Plasma etch[2] |
| Wafer size (max) | 200 mm[1] | — |
| Loading design | Open loading design (quick wafer loading/unloading)[3] | — |
| Wafer temperature control | Superior wafer temperature uniformity[3] | — |
| Compliance standards | Semi S2/S8[3] | — |
| Maximum wafer size | 200 mm[1] | — |
| Process gases (RIE 1) | CHF3, SF6, O2, Ar[1] | — |
| Process gases (RIE 2) | CF4, CHF3, SF6, O2, Ar[1] | — |
| Wafer capacity (RIE 2) | 100 mm wafers only, no chips[1] | — |
| Endpoint detection (RIE 2) | Laser reflectometry/interferometry[1] | — |
| Series name | — | 980 ACS Series[2] |
| System type | — | Single wafer cassette-to-cassette etch system[2] |
| Throughput | — | Faster throughput[2] |
| Calibration | — | Faster system calibration[2] |
| User interface | — | Touchscreen graphical user interface[2] |
| Data handling | — | Integrated data logging[2] |
| Factory automation | — | Factory automation support[2] |
| Tool format | — | Single wafer cassette-to-cassette etch system[2] |
| System calibration | — | Faster system calibration[2] |
| Automation | — | Factory automation support[2] |
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