Comparison ledger
Oxford Instruments 100 ICP Fluorine, Tokyo Electron TSP 305 SCCM SE+ Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | TSP 305 SCCM SE+ OxideTokyo Electron |
|---|---|---|
| OEM | Oxford Instruments | Tokyo Electron |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Tokyo Electron TSP 305 SCCM SE+ Oxide |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Vintage | — | 2006, 2007, 2008[2] |
| Wafer Size | — | 12"[3] |
| Carrier | — | FOUP (Comply with SEMI E47.1, 25 wafers)[3] |
| Interface | — | 5 Carrier stage (Continuous flow operation) with Semi compliant MENV and FIMS assemblies[3] |
| Process Chambers | — | 4 chambers, SCCM Oxide with Y2O3 coating[3] |
| End Point Detector | — | SE2000ii[3] |
| ESC Type | — | Ceramics ESC with STD Vpp[3] |
| Focus Ring | — | 3.4mm[3] |
| TMP | — | TMP-3403LMC-T4(VG300) (SHIMADZU)[3] |
| Dry Pump | — | ESR80WN, KEG approved[3] |
| APC | — | Pendulum Motion Dia., 320mm(VAT), R.T.~90deg[3] |
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