Waferpedia

Comparison ledger

100 ICP FluorineversusTrias 200 SPA

Oxford Instruments 100 ICP Fluorine, Tokyo Electron Trias 200 SPA, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
Trias 200 SPATokyo Electron
OEMOxford InstrumentsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments 100 ICP FluorineTokyo Electron Trias 200 SPA
Cited variants—
  • TEL Trias 200 SPA (Dry Etch)[1]
  • TEL Trias 200 SPA (CVD)[2]
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[3]—
Cryo DRIE etch rateup to 5 µm/min[3]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[3]—
Wafer Size—300 mm[1]
Process Type—Dry Etch[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]nanofab.utah.edunanofab.utah.edu