Waferpedia

Comparison ledger

100 ICP FluorineversusUnaxis 790

Oxford Instruments 100 ICP Fluorine, Plasma-Therm Unaxis 790, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
Unaxis 790Plasma-Therm
OEMOxford InstrumentsPlasma-Therm
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments 100 ICP FluorinePlasma-Therm Unaxis 790
Cited variants—
  • Unaxis 790 Middle[1]
  • Unaxis 790 Right[2]
  • Plasma-Therm Unaxis 790 Dual Chamber Shuttle Load Lock System[3]
  • Plasma-Therm Unaxis 790 DRIE PECVD[4]
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[5]—
Cryo DRIE etch rateup to 5 µm/min[5]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[5]—
Phase—3 Phase[6]
Configuration—5 Wire[6]
Voltage—208 Vac[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]nist.govnist.gov
  2. [2]nist.govnist.gov
  3. [3]capovani.comcapovani.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]nanofab.utah.edunanofab.utah.edu
  6. [6]inventory listing