Comparison ledger
Nikon 1505 G 6 E, OAI 6000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1505 G 6 ENikon | 6000OAI |
|---|---|---|
| OEM | Nikon | OAI |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | 1988– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nikon 1505 | OAI 6000 |
| Specifications | ||
| Configuration | 5" reticle[1] | Cluster configuration[4] |
| Resolution | 650 nm[2] | — |
| Numerical Aperture | 0.54[2] | — |
| Reduction | 5x[2] | — |
| Exposure Field | 15 x 15 mm[2] | — |
| Alignment Accuracy | 130 nm[2] | — |
| Wafer Size | 4 inch[1] | — |
| Light Source | g-line[3] | — |
| Introduction Year | 1988[2] | — |
| NA (Numerical Aperture) | 0.54[2] | — |
| Make | Nikon[1] | — |
| Model | 1505 G 6 E[1] | — |
| Category | Stepper[1] | — |
| Wafer Sizes | 4 inch[1] | — |
| Exposure type | g-line[2] | — |
| NA | 0.54[2] | — |
| Exposure field | 9.3 x 18.8 mm[2] | — |
| Product name | — | Model C&D P9000 / OAI 6000: Integrated Lithography Cell[4] |
| System type | — | Integrated lithography cell[4] |
| Process steps | — | Coat | Bake | Align/Expose | Develop[4] |
| Manufacture | — | Fully manufactured in the USA[4] |
| Wafer flow | — | Allows for dynamic wafer flow and parallel application processing[4] |
| Control interface | — | Single terminal for control over recipe and program selection; P9000 performs as the master user interface[4] |
| Operator requirement | — | Fewer operators needed in the lithography module[4] |
| Wafer handling | — | Reduced wafer handling[4] |
| Footprint | — | Small footprint[4] |
| Wafer size capability | — | Multiple wafer sizes can be processed simultaneously[4] |
| Product class | — | Automated Front & Backside Mask Aligner[5] |
| Application area | — | For production semiconductors, MEMS, sensors, advanced packaging, IOT, microfluidics[5] |
| Type | — | Automated Front & Backside Mask Aligner System / Integrated Lithography Cell[5] |
| Capabilities | — | Coat, Bake, Align/Expose, Develop[4] |
| Country of Manufacture | — | USA[4] |
| Wafer Size Support | — | Multiple wafer sizes can be processed simultaneously[4] |
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