Waferpedia

Comparison ledger

705versus10100

MRSI 705, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
705MRSI
10100West Bond
OEMMRSIWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyMRSI 705West Bond 10100
Specifications
ConfigurationMagazine to Magazine[1]—
TypeDie Bonder[1]—
Material HandlingMagazine to Magazine[1]—
Heating Stages4 Stage Ramp-up Heating[1]—
Holder TypeManual Loading Gelpak Holder[1]—
Head ConfigurationSingle Head[1]—
Pick-Up TypeGripper Type[1]—
Bondforce CapabilityHigh Bondforce Capable[1]—
Vintage2014[1]—
Equipment typeDie bonder[1]—
Heating4 stage ramp-up heating[1]—
LoadingManual loading[1]—
HolderGelpak holder[1]—
Bond typeGripper type[1]—
BondforceHigh bondforce capable[1]—

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing