Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7700E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7700EWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7700E |
| Cited variants | — | |
| Specifications | ||
| Wafer Size | 6 inch[2] | — |
| Wire diameter range | — | 0.0007 inches (minimum, upper limit not stated)[1] |
| Tool shank diameter | — | 1/16 inch[1] |
| Tool length | — | 0.625 inch (standard) or 0.750 inch (deeper access)[1] |
| Spool mount size | — | 1/2 inch ball bearing spool mount[1] |
| Ultrasonic generator power | — | 4 Watts, dual channel[1] |
| Number of wire buffers | — | 30[1] |
| Bonds per wire (maximum) | — | 21[1] |
| Workholder substrate size (example) | — | 2x2 inches (with mechanical clamp and inert atmosphere cavity)[1] |
| Bonding method | — | Thermosonic ball-wedge[1] |
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