Waferpedia

Comparison ledger

1 WBS 1 Wafer SubstrateversusPR-1

Logitech 1 WBS 1 Wafer Substrate, View Engineering PR-1, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
PR-1View Engineering
OEMLogitechView Engineering
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced—1978
Production run—1978–
Lifecycle—Discontinued
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateView Engineering PR-1
Specifications
Wafer Size6 inch[1]—
Image type—binary image[2]
Function—pattern recognition system[2]
Applications—automated wirebonding machines and wafer probers[2]
Technology—Binary image pattern recognition (template matching)[2]
Application—Automated wirebonding machines and wafer probers[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]en.wikipedia.orgen.wikipedia.org