Waferpedia

Comparison ledger

1 WBS 1 Wafer SubstrateversusSE 75 EV Injection

Logitech 1 WBS 1 Wafer Substrate, Sumitomo SE 75 EV Injection, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMLogitechSumitomo
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateSumitomo SE 75
Specifications
Wafer Size6 inch[1]—
Configuration—75 ton[2]
Clamping force—75 tons[2]
Vintage year—2015[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing