Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Shinkawa UTC 2000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | UTC 2000Shinkawa |
|---|---|---|
| OEM | Logitech | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Shinkawa UTC 2000 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Make | — | Shinkawa[2] |
| Model | — | UTC 2000[2] |
| Product type | — | Wire Bonder[2] |
| Listed unit vintage | — | 2006 (9 units), 2007 (2 units)[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →