Waferpedia

Comparison ledger

SEZ SP 203 Spinversus100 ICP Fluorine

Lam Research SEZ SP 203 Spin, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
SEZ SP 203 SpinLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research SEZ SP 203Oxford Instruments 100 ICP Fluorine
Specifications
Configuration50/60 Hz[1]—
Voltage400 VAC[1]—
Max. Current32 A[1]—
Breaking Capacity10.000 AIC[1]—
Power400V, 50 Hz, 3-Phase[2]—
PhaseENI VL-400 Phase Shift Controller[2]—
Roughing Pump CodeA532-80-905[2]—
OEMLam Research[3]—
ModelSEZ SP 203 Spin[1]—
CategoryEtch[3]—
Tool typeSpin etcher[3]—
Wafer size150mm[4]4 inch, 6 inch, 8 inch (with clamp change)[5]
Vintage1999[4]—
Process pump statusProcess pump in one chemical cabinet (sub tool) has malfunction[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[5]
Cryo DRIE etch rate—up to 5 µm/min[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]csisemi.comcsisemi.com
  5. [5]nanofab.utah.edunanofab.utah.edu