Comparison ledger
Lam Research IPEC 372 M, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | IPEC 372 MLam Research | 15 LapperLapmaster |
|---|---|---|
| OEM | Lam Research | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research IPEC 372 M | Lapmaster 15 |
| Specifications | ||
| Category | CMP[1] | — |
| Wafer Size | 8 inch (200 mm)[1] | — |
| Type | Automated Wafer Polishing System[2] | — |
| OEM | Lam Research[1] | — |
| Model | IPEC 372 M[3] | — |
| Wafer sizes | 8 inch[3] | — |
| Tool type | Automated wafer polishing system[1] | — |
| Also referred to as | IPEC 372M Avanti[1] | — |
| Number Of Conditioning Rings | — | Up to 3[4] |
| Ring ID | — | Up to 5.5″[4] |
| Plate Diameter – Outside | — | 15″[4] |
| Plate Diameter – Inside | — | 3 1/2″[4] |
| Standard RPM | — | 60[4] |
| Drive Motor | — | 1/2 HP[4] |
| Electrics | — | 110V / 1Ph / 60Hz[4] |
| Dimensions – Approximate | — | 26″(L-R) x 21″(F-B) x 22″(H)[4] |
| Configuration | — | Equipped with:[4] |
| Equipped with: 15″ Cast Iron Plate | — | Included[4] |
| Equipped with: (3) Yoke/Roller Bearing Assemblies | — | Included[4] |
| Equipped with: (3) Conditioning Rings | — | Included[4] |
| Equipped with: (3) Hold Downs | — | Included[4] |
| Equipped with: 30 Minute Timer | — | Included[4] |