Waferpedia

Comparison ledger

AutoEtch 490, Partsversus100 ICP Fluorine

Lam Research AutoEtch 490, Parts, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size6-inch capability—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research AutoEtch 490, PartsOxford Instruments 100 ICP Fluorine
Specifications
ConditionParts Machine, Sell it at AS IS ,Where Is term.[1]—
Quantity1 set[1]—
Wafer Size6-inch capability[1]—
Valid TimeSubject to prior sale[1]—
Lead TimeReady to go[1]—
CategoryPlasma Etch[1]—
Original Equipment ManufacturerLam Research[1]—
WarrantyN/A[1]—
RefundN/A[1]—
InspectionAgainst appointment[1]—
OEMLam Research[1]—
ModelLam AutoEtch 490, Parts Machine[1]—
Wafer size capability6-inch capability[1]—
System typein-line, cassette-to-cassette, fully automated, single-wafer, double airlocked, parallel plate plasma etching system[2]—
Chemistrieschlorine and Freon chemistries[3]—
ApplicationsPolysilicon; Silicon Nitride; Refractory metal silicides; Thin dielectrics[3]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[4]
Cryo DRIE etch rate—up to 5 µm/min[4]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]cdn2.hubspot.netcdn2.hubspot.net
  4. [4]nanofab.utah.edunanofab.utah.edu