Comparison ledger
Lam Research 9600, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 9600Lam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research TCP 9600 | Oxford Instruments 100 ICP Fluorine |
| Specifications | ||
| Voltage | 208 V[1] | — |
| Configuration | Envision Software[1] | — |
| DSQ / Exit Load Lock | Heated paddle[2] | — |
| Wafer Size | 8 inch[1] | — |
| Software | Envision Software[1] | — |
| Load/Unload | Hine Cassette Indexer[1] | — |
| Entrance Load-lock | Present[1] | — |
| Remote AC Panel | Present[1] | — |
| Main Chamber Clamping | Bottom Actuated Clamping System[1] | — |
| Main Chamber Turbo Pump | Adixen Alcatel ATH 1300[1] | — |
| Main Chamber Valve | VAT 65[1] | — |
| Main Chamber Gas Configuration | 6 Gasses[1] | — |
| Main Chamber RF Generators | RPG 1250[1] | — |
| DSQ/Exit Load Lock Gas Configuration | 3 Gases[1] | — |
| DSQ/Exit Load Lock | WVDS, Heated Paddle, APM (Atmospheric Passivation Module)[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[3] |
| Cryo DRIE etch rate | — | up to 5 µm/min[3] |
| Wafer size | — | 4 inch, 6 inch, 8 inch (with clamp change)[3] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →