Comparison ledger
Kulicke & Soffa IBond 5000, Shinkawa UTC 5000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | IBond 5000Kulicke & Soffa | UTC 5000Shinkawa |
|---|---|---|
| OEM | Kulicke & Soffa | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kulicke & Soffa IBond 5000 | Shinkawa UTC |
| Cited variants | — | |
| Specifications | ||
| Configuration | Ball-wedge bonding capability[3] | Complete with HDD[6] |
| Spool Size | Ball bonding 2" x 1" double flange spool[3] | — |
| Bonding Area | 135 x 135 mm (5.3 x 5,3 ")[3] | — |
| Throat Depth | 143 mm (5.6")[3] | — |
| Gross Table Motion | 14 mm (o.55")[3] | — |
| Bonding capability | Ball-wedge[3] | — |
| Power supply | 100-240 V, 50/60 Hz[3] | — |
| Wire feed angle | 90 degrees, vertical feed[3] | — |
| Spool size (ball bonding) | 2" x 1" double flange spool[3] | — |
| Gold wire diameter | 0.7 mil to 3.0 mil (17 to 75 microns)[3] | — |
| Copper wire diameter | 0.7 mil to 2 mil (12 to 50 microns)[3] | — |
| Bonding tool capillary lengths | 0.375", 0.437", 0.625"[3] | — |
| Bonding area (XY table) | 135 x 135 mm (5.3 x 5.3 inches)[3] | — |
| Throat depth | 143 mm (5.6 inches)[3] | — |
| Gross table motion | 14 mm (0.55 inches)[3] | — |
| Fine table motion | 14 mm (0.55 inches)[3] | — |
| Mouse ratio | 6:1[3] | — |
| Motorized Y setback | up to 4 mm (160 mil)[3] | — |
| Motorized Y reverse | up to 0.25" (10 mil)[3] | — |
| Motorized Y kink height | up to 0.5 mm (20 mil)[3] | — |
| Z axis travel | 0.500" (12.5 mm)[3] | — |
| Ultrasonic transducer frequency | 60 kHz[3] | — |
| Ultrasonic generator | Phase Lock Loop self-tuning[3] | — |
| Low ultrasonic power | 1.3 watts[3] | — |
| High ultrasonic power | 2.5 watts[3] | — |
| Bond time range | 10-1000 milliseconds (selectable ranges 10-100 ms and 10-1000 ms)[3] | — |
| Bond force range | 10-250 grams (requires added weights >80 grams), force coil range 3-80 grams[3] | — |
| Wire termination | Programmable tail pull for ball bonding[3] | — |
| Temperature control range | up to 250°C, +/-5°C[3] | — |
| Fine Table Motion | 14 mm (0.55")[3] | — |
| Equipment type | Wire bonder[4] | — |
| Make | K&S[4] | — |
| Model | IBond 5000[4] | — |
| Input power | 100-240 V, 50/60 Hz[3] | — |
| Ball bonding capillary lengths | 0.375", 0.437", 0.625"[3] | — |
| Ultrasonic system | High Q 60kHz K&S transducer[3] | — |
| Temperature control | Built-in; range up to 250 C, +/- 5 C[3] | — |
| Vintage | 2021[5] | 2019[6] |
| Wafer Size | — | 12 inch[6] |
| Type | — | Wire Bonder[1] |
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