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Comparison ledger

ConnX Eliteversus10490

Kulicke & Soffa ConnX Elite, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ConnX EliteKulicke & Soffa
10490West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa ConnxWest Bond 10490
Cited variants
  • ConnX ELITE Opto LA (Large Area)[1]
  • ConnX ELITE Opto ELA (Extended Large Area)[1]
  • ConnX ELITE Opto LA[2]
  • ConnX ELITE Opto ELA[2]
—
Specifications
Configuration50/60 Hz[3]—
Bondable area56 x 80 mm[4]—
Placement accuracy3 µm (3 sigma)[5]—
Bonding methodWire Bonder[5]—
Bonding wire length5 mm[5]—
Die pad downsetUp to 2.3 mm[5]—
Gold wire size25.4 µm[5]—
Leadframe dimensions300 x 92 mm[5]—
Magazine dimensions305 x 98 x 178 mm[5]—
Minimum loop height65 µm[5]—
Wire pitch1.27 to 25 mm[5]—
Wire sway25 µm[5]—
Air consumption185 L/min[5]—
Air pressure3.52 kg/sq cm[5]—
Power supply200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA[5]—
Net weight556 kg[5]—
Overall dimensionsBase Machine with MHS x 889 x 990 mm[5]—
Typehigh-speed automatic wire bonder[2]—
CategoryPackaging & Bonding[2]—
Power50/60 Hz[3]—
Manufacturer—West Bond[6]
Model—10490[6]
Description—Convertible bonder, wedge to ball[7]
Tool type—Convertible bonder[8]
Bonding modes—Wedge bonding and ball bonding[8]
Use—Wire bonding[8]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]zaratech.bizzaratech.biz
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]kns.comkns.com
  5. [5]semiconductor.directorysemiconductor.directory
  6. [6]Equipment inventory listing
  7. [7]fabsurplus.comfabsurplus.com
  8. [8]waferpedia.comwaferpedia.com