Comparison ledger
KLA 1.112 PSL Wafer, Toho Technology FLX-2320-S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FLX-2320-SToho Technology | |
|---|---|---|
| OEM | KLA | Toho Technology |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 1.112 PSL Wafer | Toho Technology FLX-2320-S |
| Specifications | ||
| Configuration | NIST Traceable[1] | — |
| Wafer Size | 8 inch[1] | — |
| NIST Traceable | True[1] | — |
| Compatible Tools | Surfscan 6xy0 and Sp1[2] | — |
| Measurement principle | — | Measures the change in the radius of curvature of a wafer or substrate caused by deposition of a stressed thin film.[3] |
| Use case | — | Thin-film stress measurement.[3] |
| Function | — | Measures the change in the radius of curvature of a wafer or substrate caused by the deposition of a stressed thin film.[3] |
Plan your fab
Building a Metrology & Inspection process? Get a complete equipment list.
Open the fab equipment planner →