Waferpedia

Comparison ledger

KE 3010 AL PlacementversusMy 300 SX 15

Juki KE 3010 AL Placement, Mydata My 300 SX 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Assembly / SMT, null[1]
Side-by-side comparison of selected equipment models
Attribute
OEMJukiMydata
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyJuki KE 3010 AL PlacementMydata My 300 SX 15
Specifications
Configurationw/ (2) Feeder Trolleys[1]—
MakeJuki[2]Mycronic / Mydata[3]
ModelKE 3010 AL[2]My 300 SX 15[4]
CategoryAssembly / SMT[2]—
ConveyorL Size Conveyor (14" x 16")[2]—
Head(1) Multi-Nozzle Laser Head w/ (6) Nozzles[1]Midas Head[3]
Board handlingBoard Edge Clamping System[2]—
Typeplacement system[2]—
Feeder trolleys2[2]—
Vintage2020[1]—
Software—TPSys 5.3.1d.1[3]
Machine type—Pick and place[3]
Activated software options—Hydra; Hydra High Speed; Hydra Large Component Range; Hydra Fine Pitch; Electrical Two Pole Test; Electrical Measurement; Fast Place Sequence; Line Mode; Shared Databases; Proactive Replenishment Monitor; In/Out Conveyor Board Train; In/Out Conveyor Fast Board Change[3]
Year—2020[5]
Hours—232[5]
Table—T4 Table[5]
Placement speed—Up to 24,000 CPH using the HYDRA Z8 high speed mounthead[4]
Vision system—4K resolution[4]
Fine pitch capability—Down to 0.15 mm[4]
Chip accuracy—3σ for X=50 µm, Y=75 µm and 2.6°[4]
Fine pitch accuracy—Cpk = 1.33 for X and Y = 35 µm, and 0.09°[4]
Chip repeatability—3σ for X = 30 µm and Y = 45 µm, both within 1.8°[4]
Fine pitch repeatability—Cpk = 1.33 for X and Y = 21 µm within 0.05°[4]
Options—Electrical Two-Pole Test; Shared Databases; HYDRA Electrical Measurement; HYDRA High Speed; Fast Place Sequence; HYDRA Large Component Range; HYDRA Fine Pitch; Proactive Replenishment Monitor; In/Out Conveyor Board Train; In/Out Conveyor Fast Board Change[5]
Component support—01005 chip components[4]
Accuracy—Chip accuracy of 3σ for X=50 µm, Y=75 µm and 2.6°[4]
Repeatability—Chip repeatability of 3σ for X = 30 µm and Y = 45 µm within 1.8°[4]

Plan your fab

Building a Assembly / SMT process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]microncorp.commicroncorp.com
  5. [5]midwestsmt.commidwestsmt.com