Waferpedia

Comparison ledger

2060versusYS 12 F

Juki 2060, Yamaha YS 12 F, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2060Juki
YS 12 FYamaha
OEMJukiYamaha
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyJuki 2060Yamaha YS 12 F
Specifications
Substrate size (min)—L50 × W50 mm[1]
Substrate size (max)—L510 × W460 mm[1]
Mounting accuracy—±0.05 mm / CHIP[1]
Placement rate—20,000 CPH (company conditions)[1]
Component size range—0402 to 45 × 100 mm (including ball electrode components); components up to 15 mm height[1]
Component supply method—Tape and tray supply[1]
Tape component capacity—106 types (8 mm tape conversion)[1]
Tray component capacity—15 types (JEDEC tray conversion)[1]
Power supply—Three-phase AC 200/208/220/240/380/400/416 V ±10%[1]
Air supply requirement—Above 0.45 MPa, clean and dry[1]
Dimensions (with ATS15)—L1,254 × W1,755 × H1,475 mm[1]
Weight (with ATS15)—Approx. 1,370 kg[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]cnsmtline.comcnsmtline.com