Comparison ledger
Hesse & Knipps LW1089, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LW1089Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps LW1089 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Product area | Laser Welder[1] | — |
| Model listing | LW1089[1] | — |
| Machine type | Fully automatic laser welding system with a large working area[2] | — |
| Process | Fully and semi-automatic deep penetration welding[2] | — |
| Materials | Aluminum and copper leads[2] | — |
| Applications | DCB substrates, power electronics, battery cells and modules, and other electronics manufacturing components[2] | — |
| Working area (X×Y×Z) | 410 mm × 480 mm × 75* mm[2] | — |
| Laser beam source max. power | 1.5 kW[2] | — |
| Laser beam source wavelength | 1070 nm[2] | — |
| Beam quality | Single Mode[2] | — |
| Optics max. working area | 12 mm x 12 mm[2] | — |
| Optics max. power | 1.3 kW, cw[2] | — |
| Permissible wavelength | 1070 nm[2] | — |
| Focus spot diameter | < 50 µm[3] | — |
| Line welding speed | up to 1000 mm/s[2] | — |
| Wobble frequency | up to 1000 Hz[2] | — |
| Down hold force | up to 120 N[2] | — |
| Max. immersion depth | 100 mm[2] | — |
| P-rotation | 360°[2] | — |
| Footprint | 1480 x 2150 x min. 2092 mm[2] | — |
| External switch cabinet | 800 x 1000 x 2100 mm[2] | — |
| Wafer Size | — | 6 inch[4] |
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