Waferpedia

Comparison ledger

LSB959versus10100

Hesse & Knipps LSB959, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
LSB959Hesse & Knipps
10100West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps LSB959West Bond 10100
Specifications
TypeFully automatic heavy wire bonder with thermosonic function[1]—

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Sources (1)Every fact above is drawn from these public sources
  1. [1]hesse-mechatronics.comhesse-mechatronics.com