Comparison ledger
Hesse & Knipps BJ 820, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BJ 820Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps BJ 820 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Voltage | 230 V[1] | — |
| Configuration | 50-60 Hz[1] | — |
| Type | Wire bonder[1] | — |
| Model | BJ 820[1] | — |
| Electrical | 230 V, 50-60 Hz[1] | — |
| Bond head | 45-degree bond head[3] | — |
| Included items | Microscope, monitor, vacuum work holder[3] | — |
| Vintage | 2005[3] | — |
| Equipment type | Wire bonder[1] | — |
| Electrical rating | 230 V, 50-60 Hz[1] | — |
| Wafer Size | — | 6 inch[4] |
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