Comparison ledger
Hesse & Knipps Bondjet BJ885, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Bondjet BJ885Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | latest generation of fully automated fine wire bonders | — |
| Family | Hesse & Knipps Bondjet BJ885 | Logitech 1 WBS 1 Wafer Substrate |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Fully automatic fine wire bonder[1] | — |
| Bondhead types | Wedge-wedge and ball-wedge bondheads[1] | — |
| Working area X | 370 mm (BJ885)[1] | — |
| Working area Y | 870 mm (BJ885)[1] | — |
| Working area Z | 19 mm (BJ885)[1] | — |
| Footprint W x D x H | 880 x 1780 x 1912 mm (BJ885)[1] | — |
| Weight | ca. 1800 kg (BJ885)[1] | — |
| Bonding speed | Up to 7 wires per second, depending on application and bondhead[1] | — |
| Wedge-wedge wire diameter | Al, Au, Ag, Pt: 12.5 µm – 75 µm (0.5 mil – 3 mil); Cu: 12.5 µm – 50 µm (0.5 mil – 2 mil)[1] | — |
| Ball-wedge wire diameter | Au: 15 µm – 50 µm (0.6 mil – 2 mil)[1] | — |
| Ribbon dimensions | Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1] | — |
| Ball-wedge Z axis stroke | 31 mm (1.22 in)[1] | — |
| Ball-wedge capillaries | 11/19 mm capillaries[1] | — |
| Fine pitch wedge-wedge | 40 µm inline, 25 µm staggered/dual line (depending on wire diameter and loop)[1] | — |
| Power supply | 230V AC[1] | — |
| Media connectivity | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air (CDA clean, dry air), vacuum[1] | — |
| Wafer Size | — | 6 inch[2] |
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