Comparison ledger
Hesse & Knipps Bondjet BJ 855, Signatone 1070, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Bondjet BJ 855Hesse & Knipps | 1070Signatone |
|---|---|---|
| OEM | Hesse & Knipps | Signatone |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps Bondjet BJ 855 | Signatone 1070 |
| Specifications | ||
| Equipment type | High speed fully automatic fine wire bonder (wedge-wedge and ball-wedge)[1] | — |
| Working area X | 305 mm (12 in)[1] | — |
| Working area Y | 410 mm (16 in)[1] | — |
| Working area Z | 19 mm[1] | — |
| Z stroke | 32 mm[2] | — |
| P rotation | 440°[2] | — |
| Bonding speed | Up to 7 wires per second (application dependent)[1] | — |
| Wire diameter (Al, Au, Ag, Pt) | 12.5 µm – 75 µm (0.5 mil – 3 mil)[1] | — |
| Wire diameter (Cu) | 12.5 µm – 50 µm (0.5 mil – 2 mil)[1] | — |
| Wire materials | Al, Au, Ag, Cu, Pt, Ni[3] | — |
| Ribbon dimensions | Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1] | — |
| Fine pitch (wedge-wedge) | 40 µm inline, 25 µm staggered/dual line (depending on wire diameter and loop)[1] | — |
| Bondhead options | Wedge-wedge bondhead 45°, 60°, 90° (deep access for ribbon or wire); ball-wedge bondhead[2] | — |
| Ultrasonic frequency | 100 kHz (alternative frequencies available on request)[3] | — |
| Footprint (W x D x H) | 740 mm x 1484 mm x 1912 mm[1] | — |
| Weight | approx. 1150 kg[1] | — |
| Power supply | 230 V AC, 16 A[2] | — |
| Media connectivity | Compressed air (clean, dry air / high purity), vacuum[1] | — |
| Interfaces | Gigabit Ethernet (TCP/IP), USB ports, HDMI, SMEMA connection, Profibus support[2] | — |
| Make | — | Signatone[4] |
| Model | — | 1070[4] |
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